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The MultiConnect® Conduit AP conveniently provides deep in-building...
The modules can be designed with your products and integrated onto your board design to enable wireless Bluetooth connectivity.
The Parani-BCD210 series Bluetooth Class 2 OEM module family is available in SMD or DIP packages with Chip, U.FL and SMA antenna options for OEM manufactures who want to implement Bluetooth Class 2 functionality with their products cost effectively and also in timely manner. If you would like more information or volume pricing please contact us